Economical, flexible, potting and casting polyurethane system. a solventless, low viscosity, flexible, two component polyurethane casting resin. CLP 7330 / CLI 4161
Semi-flexible epoxy adhesive and casting system. An unfilled, semi-flexible two component epoxy system. Its low mixed viscosity makes it suitable for potting and encapsulating electronic components. CLR 1020 / CLH 6021
Low viscosity, semi-flexible. An unfilled, semi-flexible two component epoxy system. Its low mixed viscosity makes it suitable for potting and encapsulating electronic components. CLR 1026 / CLH 6021
Large mass casting, 30-minute pot life. Masses larger than 6Lbs. A two component, filled, room temperature cure epoxy system.the product has a low exotherm and low shrinkage, making it suitable for castings larger than 3 kgs. CLR 1066 / CLH 6930
A low viscosity, two component, unfilled, room temperature cure, epoxy system. This system provides resiliency and strength making it suitable for a variety of applications. ie. adhesives, castings, coatings and tooling. CLR 1180 / CLH 6020
Flexible epoxy casting and potting system. An unfilled, semi-flexible epoxy casting system with long pot life. This product may be used in large mass casting. CLR 1180 / CLH 6520
Room temp cure, Excellent shock resistance. An exceptional epoxy casting system with excellent thermal and mechanical shock resistance. CLR 1180 / CLH 6560
A two component, unfilled, room temperature cure epoxy, for coating, casting, and adhesive applications. CLR 1180 / CLH 6770
Room temp cure, excellent shock resistance. An exceptional epoxy laminating system with excellent thermal and mechanical shock resistance. Product is suitable for a variety of applications. CLR 1180 / CLH 6930
Shock resistant, General purpose epoxy. A two component epoxy casting system. product has low shrinkage and excellent shock resistance. CLR 1183 / CLH 6560
A low viscosity, aluminum filled, room temperature gelling casting system. Product has excellent surface reproduction and high strength. This system is recommended for use with aluminum shot for large mass casting. The product may be cast up to 2 inches in depth. CLR 1296 / XHD 1303
General Purpose Aluminum. An aluminum filled, low viscosity, room temperature gelling, casting system. The product has excellent surface reproduction, and high strength. This system is recommended for use with aluminum shot for large mass casting. CLR 1299 / CLH 6330
General Purpose Aluminum. An aluminum filled, low viscosity, room temperature gelling, casting system. The product has excellent surface reproduction, and high strength. This system is recommended for use with aluminum shot for large mass casting. CLR 1299 / XHD 1303
Heat and chemical/fuel resistant adhesive/laminating. A two component heat and chemical resistant epoxy laminating system. CLR 1730 / CLH 6372
UL 94-V0 system for potting and casting small electronic parts that require thermal shock and thermal cycling performance. A two component, low viscosity, room temperature cure epoxy system. Material has yellow card UL94-V0 rating, and contains non abrasive fillers suitable for meter mix dispense. CLR 1796 / CLH 6580
General Adhesive room temperature cure. Resistant to Toluene, Ethanol, Aviation Gas and Diesel Fuel. A low viscosity, two component, chemical resistant epoxy system. Post cured material has excellent resistance to most petroleum based fuels and solvents during exposure at ambient and elevated temperatures. CLR 3080 / CLH 6372
High Temperature. A single component, 100% solids, low viscosity, impregnating compound for coils and transformers. This product is also suitable for sand casting. CLS 9600
A low viscosity, single component, epoxy potting and encapsulating compound. The product has excellent stability and good adhesion to a wide range of substrates. This product meets UL 94-HB flammability requirements. Heat Cure Single Component semi-flexible epoxy potting and encapsulating system. Product is suitable for potting ferrites and pressure sensitive components in electrical and electronic applications. CLS 9611
Heat Cure. Single Component semi-flexible epoxy potting and encapsulating system. Product is suitable for potting ferrites and pressure sensitive components in electrical and electronic applications. Low viscosity. The product has excellent stability and good adhesion to a wide range of substrates. This product meets UL94-HB flammability requirements. CLS 9616
High temperature clear epoxy. An unfilled, heat resistant, clear laminating system. Products low viscosity gives the system excellent wet-out properties to fibreglass and other reinforcing fibres. The material exhibits high physical strengths and modulus with moderate post cure temperatures. XRD 1014 / XHD 1015